TUF Gaming B550-PLUS WIFI II AMD B550 Socket AM4 ATX

ROCK-SOLID PERFORMANCE

With upgraded power delivery and comprehensive cooling options to fuel the latest AMD Ryzen CPUs, plus support for faster memory and storage, TUF Gaming B550-Plus (Wi-Fi) is the perfect foundation for your next high-core-count battle rig.

Power Design

DrMOS

The onboard VRM of TUF GAMING B550-PLUS WIFI II utilizes 8+2 DrMOS power stages that combine high-side and low-side MOSFETs and driver into a single package, delivering the power and efficiency that 3rd Gen AMD Ryzen™ Processors demand.

Stack Cool 3+

2-ounce copper layers draw heat away from critical components to keep them at their optimal operating temperatures and provide more headroom to push CPUs beyond stock speeds.

ProCool Socket

ENHANCED 8-PIN CONNETOR

・ Extreme durability

・ Prevent hotspots and connector failure

Compared with traditional power inputs, ProCool sockets are built to tight specifications to ensure flush contact with PSU power lines. The resulting lower impedance helps to prevent hotspots and connector failure.

TUF CHOKES

Certified military-grade TUF chokes deliver rock-steady power to the CPU, improving system stability.

TUF CAPACITORS

Proprietary capacitors provide up to 20% greater temperature tolerance and 5X-longer lifespan.

Digi+ VRM

The integrated Digi+ VRM voltage-regulator module (VRM) is one of the finest in the industry, ensuring ultra-smooth and ultra-clean power delivery to the CPU at all times.

Cooler by design

1. VRM HEATSINK

A large, high-mass heatsink with extensive surface that covers the VRM and choke areas improves heat dissipation.

THERMAL PAD

High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.

2. M.2 HEATSINK

The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.

PCIe 4.0 M.2 (up to 64 Gbps)

TUF Gaming B550 series motherboards support PCIe 4.0 M.2 slot and provides NVMe SSD RAID support for an incredible performance boost. Create a RAID configuration with up to PCIe 4.0 storage device to enjoy the fastest data-transfer speeds on the 3rd Generation AMD Ryzen platform.